Subject: Re: [PATCH 2/3] arm64: dts: sparx5: Add hwmon temperature sensor

From: Alexandre Belloni <[email-masked]>
Date: Thu, 28 May 2020 05:39:41 +0200

Hi Rob,

On 27/05/2020 20:29:31-0600, Rob Herring wrote:
> On Wed, May 13, 2020 at 03:41:39PM +0200, Lars Povlsen wrote:
> > This adds a hwmon temperature node sensor to the Sparx5 SoC.
> > 
> > Reviewed-by: Alexandre Belloni <[email-masked]>
> > Signed-off-by: Lars Povlsen <[email-masked]>
> > ---
> >  arch/arm64/boot/dts/microchip/sparx5.dtsi | 6 ++++++
> >  1 file changed, 6 insertions(+)
> > 
> > diff --git a/arch/arm64/boot/dts/microchip/sparx5.dtsi b/arch/arm64/boot/dts/microchip/sparx5.dtsi
> > index f09a49c41ce19..b5f2d088af30e 100644
> > --- a/arch/arm64/boot/dts/microchip/sparx5.dtsi
> > +++ b/arch/arm64/boot/dts/microchip/sparx5.dtsi
> > @@ -233,5 +233,11 @@ i2c1: i2c@600103000 {
> >  			clock-frequency = <100000>;
> >  			clocks = <&ahb_clk>;
> >  		};
> > +
> > +		tmon0: tmon@610508110 {
> > +			compatible = "microchip,sparx5-temp";
> > +			reg = <0x6 0x10508110 0xc>;
> 
> These nodes are all very odd with a couple of registers spread out at 
> randomish addresses. DT nodes should roughly correlate to h/w blocks, 
> not sets of registers for a driver like this seems to be.
> 

The DT nodes correlates to HW block, this and the previous families of
SoCs were designed with packed registers. There is no padding between HW
block registers.

-- 
Alexandre Belloni, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com

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