Subject: Re: [PATCH bpf-next] selftests/bpf: add xdp_feature selftest for bond device

From: [email-masked]
Date: Tue, 23 May 2023 14:30:20 +0000

Hello:

This patch was applied to bpf/bpf-next.git (master)
by Daniel Borkmann <[email-masked]>:

On Wed, 17 May 2023 15:41:33 +0200 you wrote:
> Introduce selftests to check xdp_feature support for bond driver.
> 
> Signed-off-by: Lorenzo Bianconi <[email-masked]>
> ---
>  .../selftests/bpf/prog_tests/xdp_bonding.c    | 121 ++++++++++++++++++
>  1 file changed, 121 insertions(+)

Here is the summary with links:
  - [bpf-next] selftests/bpf: add xdp_feature selftest for bond device
    https://git.kernel.org/bpf/bpf-next/c/6cc385d2cdb4

You are awesome, thank you!
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