Subject: [PATCH 0/2] Bonding device changes for later RTNL_LINK interface

From: Stephen Hemminger <[email-masked]>
Date: Wed, 10 Jun 2009 09:39:55 -0700

I am working on a RTNL_LINK interface for bonding. These are
small internal changes that making doing that easier. Plus they
make bonding devices more like other usages.

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